雙面(mian)板(ban)(ban)是(shi)(shi)中(zhong)(zhong)間(jian)一(yi)層(ceng)介質，兩(liang)面(mian)都是(shi)(shi)走(zou)(zou)線層(ceng)。多(duo)層(ceng)板(ban)(ban)就是(shi)(shi)多(duo)層(ceng)走(zou)(zou)線層(ceng)，每(mei)兩(liang)層(ceng)之間(jian)是(shi)(shi)介質層(ceng)，介質層(ceng)可(ke)以做的(de)(de)很薄。多(duo)層(ceng)電路板(ban)(ban)至(zhi)少(shao)有三層(ceng)導電層(ceng)，其(qi)中(zhong)(zhong)兩(liang)層(ceng)在(zai)外(wai)表面(mian)，而剩下的(de)(de)一(yi)層(ceng)被合成在(zai)絕緣板(ban)(ban)內。它們之間(jian)的(de)(de)電氣連接通常是(shi)(shi)通過電路板(ban)(ban)橫斷(duan)面(mian)上的(de)(de)鍍通孔實(shi)現的(de)(de)。

多層線路板的優缺點

優點：

裝配(pei)密(mi)度(du)高(gao)、體積小、質量輕由于裝配(pei)密(mi)度(du)高(gao)，各組(zu)件（包括元器件）間(jian)的連線減少，因此提(ti)高(gao)了可(ke)靠性(xing)(xing)；可(ke)以增(zeng)加(jia)布線層(ceng)數，從而(er)加(jia)大了設計靈活性(xing)(xing)；能構(gou)成(cheng)具(ju)有一定阻抗的電(dian)路(lu)(lu);可(ke)形成(cheng)高(gao)速(su)傳輸電(dian)路(lu)(lu);可(ke)設置電(dian)路(lu)(lu)、磁(ci)路(lu)(lu)屏(ping)蔽層(ceng)，還可(ke)設置金屬芯散(san)熱(re)層(ceng)以滿足屏(ping)蔽、散(san)熱(re)等特種(zhong)功(gong)能需要(yao);安裝簡單，可(ke)靠性(xing)(xing)高(gao)。

缺點：

造(zao)價(jia)高(gao)(gao)(gao)；周期長；需(xu)要高(gao)(gao)(gao)可靠(kao)性(xing)的檢(jian)測手段。多層(ceng)印(yin)制(zhi)電(dian)路是(shi)電(dian)子技(ji)術向高(gao)(gao)(gao)速(su)度(du)、多功(gong)能、大容量、小(xiao)體積(ji)方向發展的產(chan)物(wu)。隨著電(dian)子技(ji)術的不斷發展，尤其是(shi)大規(gui)模(mo)和超大規(gui)模(mo)集成(cheng)電(dian)路的廣泛深入應(ying)用，多層(ceng)印(yin)制(zhi)電(dian)路正迅速(su)向高(gao)(gao)(gao)密度(du)、高(gao)(gao)(gao)精度(du)、高(gao)(gao)(gao)層(ceng)數化(hua)方向發展t出現了微(wei)細線(xian)條、小(xiao)孔(kong)徑(jing)貫(guan)穿、盲孔(kong)埋孔(kong)、高(gao)(gao)(gao)板厚孔(kong)徑(jing)比(bi)等技(ji)術以(yi)滿足(zu)市場的需(xu)要。

多層pcb線路板與雙面板區別

多層(ceng)(ceng)pcb線(xian)路板(ban)(ban)(ban)是(shi)由(you)交替的導電(dian)圖形層(ceng)(ceng)及絕(jue)緣材(cai)料層(ceng)(ceng)壓粘合而(er)成的一(yi)種印制電(dian)路板(ban)(ban)(ban)。導電(dian)圖形的層(ceng)(ceng)數在三層(ceng)(ceng)以(yi)上，層(ceng)(ceng)間電(dian)氣互連是(shi)通過金屬化孔實現的。如(ru)果用一(yi)塊(kuai)(kuai)雙面板(ban)(ban)(ban)作為(wei)(wei)內層(ceng)(ceng)、兩(liang)塊(kuai)(kuai)單(dan)(dan)面板(ban)(ban)(ban)作為(wei)(wei)外(wai)層(ceng)(ceng)或兩(liang)塊(kuai)(kuai)雙面板(ban)(ban)(ban)做內層(ceng)(ceng)、兩(liang)塊(kuai)(kuai)單(dan)(dan)面板(ban)(ban)(ban)作為(wei)(wei)外(wai)層(ceng)(ceng)，通過定位系統及絕(jue)緣黏結材(cai)料疊壓在一(yi)起(qi)，并將(jiang)導電(dian)圖形按設計(ji)要求(qiu)進行互連，就成為(wei)(wei)四(si)層(ceng)(ceng)、六層(ceng)(ceng)印制電(dian)路板(ban)(ban)(ban)，也稱為(wei)(wei)多層(ceng)(ceng)pcb線(xian)路板(ban)(ban)(ban)。

對(dui)比一般多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)和(he)(he)(he)(he)雙面(mian)(mian)(mian)板(ban)(ban)(ban)的(de)生(sheng)產(chan)工(gong)(gong)藝，主要(yao)(yao)(yao)的(de)不同(tong)是多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)增加了幾個特有(you)的(de)工(gong)(gong)藝步驟：內(nei)(nei)層(ceng)(ceng)(ceng)(ceng)成(cheng)(cheng)像和(he)(he)(he)(he)黑(hei)化(hua)、層(ceng)(ceng)(ceng)(ceng)壓、凹(ao)蝕和(he)(he)(he)(he)去鉆(zhan)污(wu)。在大部分(fen)相同(tong)的(de)工(gong)(gong)藝中，某些工(gong)(gong)藝參數、設(she)備精度和(he)(he)(he)(he)復(fu)雜(za)程度方面(mian)(mian)(mian)也有(you)所不同(tong)。如多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)的(de)內(nei)(nei)層(ceng)(ceng)(ceng)(ceng)金屬(shu)化(hua)連接是多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)可靠性的(de)決定性因素，對(dui)孔壁的(de)質(zhi)量要(yao)(yao)(yao)求比雙層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)要(yao)(yao)(yao)嚴(yan)，因此(ci)對(dui)鉆(zhan)孔的(de)要(yao)(yao)(yao)求就更高(gao)。另外，多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)每次鉆(zhan)孔的(de)疊板(ban)(ban)(ban)數、鉆(zhan)孔時鉆(zhan)頭的(de)轉(zhuan)速和(he)(he)(he)(he)進給量都和(he)(he)(he)(he)雙面(mian)(mian)(mian)板(ban)(ban)(ban)有(you)所不同(tong)。多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)成(cheng)(cheng)品(pin)和(he)(he)(he)(he)半成(cheng)(cheng)品(pin)的(de)檢驗也比雙面(mian)(mian)(mian)板(ban)(ban)(ban)要(yao)(yao)(yao)嚴(yan)格和(he)(he)(he)(he)復(fu)雜(za)的(de)多(duo)。多(duo)層(ceng)(ceng)(ceng)(ceng)板(ban)(ban)(ban)由(you)于結構(gou)復(fu)雜(za)，所以要(yao)(yao)(yao)采用溫度均勻的(de)甘油熱熔(rong)工(gong)(gong)藝，而不采用可能導致局(ju)部溫升過高(gao)的(de)紅外熱熔(rong)工(gong)(gong)藝等。