激光打標是以(yi)極(ji)其細微的(de)光斑打出各種(zhong)符號(hao)，文(wen)字，圖(tu)案(an)等(deng)等(deng)，光斑大小可以(yi)以(yi)微米量級。對微型工加(jia)或(huo)是防偽有著(zhu)更(geng)深的(de)意義(yi)。

        聚焦過后的(de)(de)極(ji)細激(ji)光(guang)(guang)如同利刃，可將物體(ti)表面的(de)(de)材質逐(zhu)點除(chu)去。最大(da)好處在于標(biao)記的(de)(de)過程中是非接觸性的(de)(de)加(jia)工，不(bu)會產(chan)(chan)生(sheng)負面的(de)(de)劃(hua)傷(shang)(shang)和摩擦，也不(bu)會造成擠(ji)壓(ya)或是壓(ya)傷(shang)(shang)等情況。因此不(bu)會損壞要加(jia)工的(de)(de)物品。由于激(ji)光(guang)(guang)束(shu)再度變焦后光(guang)(guang)斑(ban)變得更加(jia)細小，產(chan)(chan)生(sheng)的(de)(de)熱效應(ying)區域小，加(jia)工精確，因此可以完成一(yi)些常規無法(fa)完成，無法(fa)實現的(de)(de)工藝。

        激(ji)光(guang)(guang)(guang)(guang)(guang)加(jia)工(gong)(gong)(gong)能借(jie)助現代的(de)CAD/CAM軟(ruan)件(jian)，實(shi)(shi)現任(ren)何形式(shi)的(de)板(ban)材切(qie)(qie)割(ge)(ge)(ge)，采用(yong)激(ji)光(guang)(guang)(guang)(guang)(guang)加(jia)工(gong)(gong)(gong)，不僅加(jia)工(gong)(gong)(gong)速度快，效(xiao)率高(gao)(gao)，成本(ben)低，而且避免(mian)了(le)(le)模(mo)具(ju)更換，縮短(duan)(duan)了(le)(le)生產準備時(shi)間(jian)(jian)周期(qi)。易(yi)于實(shi)(shi)現連續加(jia)工(gong)(gong)(gong)，激(ji)光(guang)(guang)(guang)(guang)(guang)光(guang)(guang)(guang)(guang)(guang)束換位時(shi)間(jian)(jian)短(duan)(duan)，提高(gao)(gao)了(le)(le)生產效(xiao)率。可進行多種工(gong)(gong)(gong)件(jian)交替(ti)安(an)裝。一(yi)個工(gong)(gong)(gong)件(jian)加(jia)工(gong)(gong)(gong)時(shi)，可卸(xie)下已完(wan)成的(de)部件(jian)，并安(an)裝待加(jia)工(gong)(gong)(gong)工(gong)(gong)(gong)件(jian)，實(shi)(shi)現并行加(jia)工(gong)(gong)(gong)，減少安(an)裝時(shi)間(jian)(jian)，增加(jia)激(ji)光(guang)(guang)(guang)(guang)(guang)加(jia)工(gong)(gong)(gong)時(shi)間(jian)(jian)。激(ji)光(guang)(guang)(guang)(guang)(guang)切(qie)(qie)割(ge)(ge)(ge)以(yi)其高(gao)(gao)速的(de)、高(gao)(gao)精(jing)度、高(gao)(gao)質量、節能環保等(deng)特點(dian)，已經成為現代金屬加(jia)工(gong)(gong)(gong)的(de)技術發(fa)展方(fang)向。在激(ji)光(guang)(guang)(guang)(guang)(guang)加(jia)工(gong)(gong)(gong)應用(yong)中，激(ji)光(guang)(guang)(guang)(guang)(guang)切(qie)(qie)割(ge)(ge)(ge)占到32%的(de)市(shi)場(chang)份額。激(ji)光(guang)(guang)(guang)(guang)(guang)切(qie)(qie)割(ge)(ge)(ge)與其他切(qie)(qie)割(ge)(ge)(ge)方(fang)法相比，最(zui)大(da)的(de)區別(bie)是(shi)它具(ju)有(you)高(gao)(gao)速、高(gao)(gao)精(jing)度和高(gao)(gao)適應性(xing)的(de)特點(dian)。同(tong)時(shi)還(huan)具(ju)有(you)割(ge)(ge)(ge)縫小(xiao)，熱影響區小(xiao)、切(qie)(qie)割(ge)(ge)(ge)面質量好、切(qie)(qie)割(ge)(ge)(ge)時(shi)無噪(zao)聲、切(qie)(qie)縫邊緣垂直度好、切(qie)(qie)邊光(guang)(guang)(guang)(guang)(guang)滑、切(qie)(qie)割(ge)(ge)(ge)過程容易(yi)實(shi)(shi)現自動化控制(zhi)等(deng)優點(dian)。激(ji)光(guang)(guang)(guang)(guang)(guang)切(qie)(qie)割(ge)(ge)(ge)板(ban)材時(shi)，不需要(yao)模(mo)具(ju)，可以(yi)替(ti)代一(yi)些需要(yao)采用(yong)復雜大(da)型模(mo)具(ju)的(de)沖切(qie)(qie)加(jia)工(gong)(gong)(gong)方(fang)法，能大(da)大(da)縮短(duan)(duan)生產周期(qi)和降(jiang)低成本(ben)。

        手(shou)(shou)機(ji)加工(gong)(gong)制(zhi)造70%的(de)(de)環(huan)節都應用到激(ji)(ji)光(guang)(guang)(guang)技術及(ji)激(ji)(ji)光(guang)(guang)(guang)制(zhi)造設備(bei)(bei)。特(te)(te)別是近年來高(gao)(gao)功率、高(gao)(gao)能(neng)量紫(zi)外打標機(ji)、深(shen)紫(zi)外和超快(kuai)激(ji)(ji)光(guang)(guang)(guang)加工(gong)(gong)技術的(de)(de)發(fa)展，促進(jin)了智能(neng)手(shou)(shou)機(ji)制(zhi)造技術的(de)(de)發(fa)展。這與激(ji)(ji)光(guang)(guang)(guang)技術性(xing)質及(ji)手(shou)(shou)機(ji)精(jing)密(mi)制(zhi)造性(xing)質有(you)關。一(yi)(yi)方面(mian)(mian)，由于(yu)激(ji)(ji)光(guang)(guang)(guang)具有(you)功率密(mi)度高(gao)(gao)、方向(xiang)性(xing)好、清潔、高(gao)(gao)效、環(huan)保(bao)等突出特(te)(te)點，激(ji)(ji)光(guang)(guang)(guang)加工(gong)(gong)技術取代(dai)傳統(tong)加工(gong)(gong)技術的(de)(de)趨勢日益加快(kuai)，其微加工(gong)(gong)優勢在激(ji)(ji)光(guang)(guang)(guang)焊接機(ji)、激(ji)(ji)光(guang)(guang)(guang)打標機(ji)、激(ji)(ji)光(guang)(guang)(guang)切割機(ji)等方面(mian)(mian)優勢十分明顯。另(ling)一(yi)(yi)方面(mian)(mian)，手(shou)(shou)機(ji)加工(gong)(gong)是一(yi)(yi)門精(jing)密(mi)制(zhi)造技術的(de)(de)結(jie)晶，需要(yao)微加工(gong)(gong)制(zhi)造設備(bei)(bei)。

        激(ji)光(guang)打(da)(da)孔(kong)(kong)(kong)是重要的(de)手機(ji)(ji)加(jia)(jia)工(gong)應(ying)用(yong)(yong)技(ji)術之(zhi)(zhi)一(yi)。激(ji)光(guang)聚(ju)(ju)焦光(guang)斑可以聚(ju)(ju)一(yi)波長量(liang)級，在(zai)很(hen)小的(de)區域內集(ji)中很(hen)高(gao)的(de)能(neng)量(liang)，特別適(shi)合于加(jia)(jia)工(gong)微(wei)細深孔(kong)(kong)(kong)，最小孔(kong)(kong)(kong)徑只有(you)幾微(wei)米，孔(kong)(kong)(kong)深和孔(kong)(kong)(kong)徑比(bi)可大(da)于50微(wei)米。激(ji)光(guang)打(da)(da)孔(kong)(kong)(kong)在(zai)手機(ji)(ji)應(ying)用(yong)(yong)中可用(yong)(yong)于PCB板打(da)(da)孔(kong)(kong)(kong)、外殼聽(ting)筒及天(tian)線(xian)打(da)(da)孔(kong)(kong)(kong)、耳機(ji)(ji)打(da)(da)孔(kong)(kong)(kong)等，具有(you)效(xiao)率高(gao)、成本低、變(bian)形小、適(shi)用(yong)(yong)范(fan)圍(wei)廣(guang)等優點。手機(ji)(ji)一(yi)個巴掌(zhang)大(da)地(di)方聚(ju)(ju)焦200多個零部件，其加(jia)(jia)工(gong)制造技(ji)術可算是當(dang)令難(nan)度較大(da)的(de)生產(chan)制造技(ji)術之(zhi)(zhi)一(yi)。在(zai)一(yi)塊半指(zhi)稍寬一(yi)點、一(yi)指(zhi)長一(yi)點、一(yi)公分(fen)高(gao)一(yi)點的(de)空間內，將LPC、攝像(xiang)頭、LCD、液晶屏、線(xian)路板、天(tian)線(xian)等200多個零件加(jia)(jia)工(gong)、鑲嵌、整合在(zai)一(yi)起，對其精密度要求很(hen)高(gao)。激(ji)光(guang)技(ji)術是推動(dong)中國手機(ji)(ji)制造業迅速(su)崛起的(de)重要技(ji)術。